Controlling of photo-generated charge carriers

ABSTRACT

Embodiments related to controlling of photo-generated charge carriers are described and depicted. At least one embodiment provides a semiconductor substrate comprising a photo-conversion region to convert light into photo-generated charge carriers; a region to accumulate the photo-generated charge carriers; a control electrode structure including a plurality of control electrodes to generate a potential distribution such that the photo-generated carriers are guided towards the region to accumulate the photo-generated charge carriers based on signals applied to the control electrode structure; a non-uniform doping profile in the semiconductor substrate to generate an electric field with vertical field vector components in at least a part of the photo-conversion region

RELATED APPLICATIONS

This application claims priority benefit of provisional patentapplication 61/731,373, which was filed on Nov. 29, 2012. The entirecontents of the indicated provisional patent application are herebyincorporated herein by reference.

BACKGROUND

Photo-sensitive devices such as imager devices are used in manyapplications and variations. In addition to solid state imagers like CCD(charge coupled devices) imagers or CMOS (Complementary Metal OxideSemiconductor) imagers which are capable of providing 2D (2 dimensional)images, 3D imager or depth imagers are becoming increasingly popular formultiple applications. For 3D imaging and depth imaging, optical sensorsbased on time-of-flight (TOF) are very promising for future applicationsranging from the taking of a profile of objects or environments, thetracking and recognition of objects and human beings to the recognitionof movements of certain parts or gesture recognition.

In applications of TOF sensors as well as for other optical imagers, thetransfer of charge is crucial to the operation of the imager. To giveone example, for the demodulation of incoming light provided by deviceswhich are based on the time-of-flight principle the timely transfer ofcharge carriers to the read-out nodes is critical for the accuracy ofthe depth information as well as other operation parameters.

SUMMARY

According to one aspect, a method of manufacturing a device comprisesproviding a non-uniform doping profile such that an electric field withvertical field vector components is generated in at least a part of aphoto-conversion region and generating a control electrode structureincluding a plurality of control electrodes above the non-uniform dopingprofile for directing photo-generated charge carriers.

According to a further aspect, a device includes a semiconductorsubstrate comprising a photo-conversion region to convert light intophoto-generated charge carriers, a region to accumulate thephoto-generated charge carriers and a control electrode structureincluding a plurality of control electrodes to generate a potentialdistribution such that the photo-generated carriers are guided towardsthe region to accumulate the photo-generated charge carriers based onsignals applied to the control electrode structure. A non-uniform dopingprofile is provided in the semiconductor substrate to generate anelectric field with vertical field vector components in at least a partof the photo-conversion region.

According to a further aspect a device includes a substrate with a firstmain surface and a second main surface, the substrate comprising aphoto-conversion region to convert incoming light into photo-generatedcharge carriers. The device is configured to receive the incoming lightat the second main surface. At least one region is provided toaccumulate the photo-generated charge carriers located at the first mainsurface. A control electrode structure is arranged at the first mainsurface to generate a potential distribution in the semiconductorsubstrate such that the photo-generated carriers are guided towards theat least one region to accumulate the photo-generated charge carriersbased on signals applied to the control electrode structure. Asemiconductor doping profile to generate an electric field with verticalfield vector components in at least a part of the photo-conversionregion.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A shows a device according to an embodiment.

FIG. 1B shows example potential distributions for the device of FIG. 1A.

FIG. 2A shows a device according to a further embodiment.

FIG. 2B shows example potential distributions for the device of FIG. 2A.

FIG. 3 shows a device according to a further embodiment.

FIG. 4 shows a device according to a further embodiment.

FIG. 5 shows a device according to a further embodiment.

FIG. 6 shows a flow diagram according to an embodiment.

FIG. 7 shows a flow diagram according to an embodiment.

FIG. 8 shows a time-of-flight system application according to anembodiment.

FIG. 9 shows examples of step-wise doping profiles.

DETAILED DESCRIPTION

The following detailed description explains exemplary embodiments. Thedescription is not to be taken in a limiting sense, but is made only forthe purpose of illustrating the general principles of embodiments whilethe scope of protection is only determined by the appended claims.

In the exemplary embodiments shown in the drawings and described below,any direct connection or coupling between functional blocks, devices,components or other physical or functional units shown in the drawingsor described herein can also be implemented by an indirect connection orcoupling. Functional blocks may be implemented in hardware, firmware,software, or a combination thereof.

Further, it is to be understood that the features of the variousexemplary embodiments described herein may be combined with each other,unless specifically noted otherwise.

In the various figures, identical or similar entities, modules, devicesetc. may have assigned the same reference number.

The term vertical is used in a non-limiting way to describe inembodiments directions vertical or substantially vertical to a surfaceof a substrate such as a main surface of the substrate. The term lateralis used in a non-limiting way to describe in embodiments directionsparallel or substantially parallel to a surface of a substrate such as amain surface of the substrate.

The term substrate used in embodiments may include but is not limited tosemiconductor substrates such as a semiconductor die, a stacked die, asemiconductor die with one or more additional semiconductor layers suchas epi-layers, poly-silicon layers etc.

FIG. 1 shows an embodiment of a device 100 which includes a substrate102 having a photo-conversion region 112. The device is configured suchthat light penetrates into the photo-conversion region 112 and at leasta part of the incoming light is converted into charge carriers of bothtypes, i.e. electrons and holes. In some embodiments, the light might beintroduced to the photo-conversion region from a front side 100 a of thedevice 100. In other embodiments, the light might be introduced to thephoto-conversion region from the back side 100 b of device 100. Thephoto-conversion region may in embodiments extend in vertical directionbetween 15 μm and 60 μm into the substrate with each value in this rangeand each sub-range constituting a specific embodiment.

The device 100 further includes a layer 104 of insulating material abovewhich a first control electrode 106 a, a second control electrode 106 band a third control electrode 106 c are provided. Layer 104 is typicallyprovided as thin layer, e.g. a gate layer, and may for example includesilicon oxide. The elements shown in FIG. 1A may form a single pixel ofplurality of pixels. Thus, the control electrodes may form in someembodiments the modulation gates of a demodulation structure within apixel of a continuous wave time-of-flight imager. It is therefore to benoted that in some embodiments multiple pixels are formed within thedevice resulting in a repetition of the structures and elements shown inFIG. 1A for a single pixel.

Structures 108 are formed between the control electrodes 106 a, 106 b,106 c. The structures 108 may include for example spacers or linersgenerated in the manufacturing process for electric isolation of thecontrol electrodes 106 a, 106 b, 106 c. Other structures not shown inFIG. 1A such as metal layers and vias may be further included in thedevice 100.

Furthermore, a cover layer 110 extending above the semiconductorsubstrate 102 is provided. As can be seen from FIG. 1A, the cover layer110 covers the control electrodes 106 a, 106 b, 106 c and the structures108 provided in the device 100. In some embodiments, additional elementssuch as shielding elements for shielding light-sensitive areas such asread-out nodes may be provided in or above the cover layer 110

In the embodiment of FIG. 1A, the second control electrode 106 b isarranged between the first control electrode 106 a and the third controlelectrode 106 c with respect to a lateral direction (x-direction). Insome embodiments, the second control electrode has a lateral distance toat least one of the first or second control electrode between 50 nm and1 μm, where each value within this range and each sub-range constitutesone embodiment. In some embodiments, the third control electrode has alateral distance to at least one of the first or second controlelectrode between 0.1 μm and 0.5 μm. In some embodiments, the secondcontrol electrode has a lateral distance to both of the first or thirdcontrol electrode between 50 nm and 1 μm, where each value within thisrange and each sub-range constitutes one embodiment. In someembodiments, the second control electrode has a lateral distance to bothof the first or third control electrode between 0.1 μm and 0.5 μm.

In embodiments, the control electrodes 106 a, 106 b and 106 c aremanufactured such that the control electrodes are transparent or atleast semi-transparent to the incoming light generating the chargecarriers in the photo-conversion region 112. This may be provided byhaving a respective thin layer for the electrodes and/or using materialwhich is transparent or semi-transparent for the incoming light. In someembodiments, the light of operation may be infrared light ornear-infrared light. In some embodiments, the light of operation may bevisible light. As will be described later on with respect to FIG. 8, thelight of operation may be modulated when emitted from a light source bya modulation signal. When used within a demodulation pixel, the controlelectrodes are then provided with a signal having a same frequency but apredefined time delay with respect to the light modulation signal.

In embodiments, the control electrodes 106 a, 106 b, 106 c areelectrodes to direct the photo-generated charge carriers in a lateraldirection based on the potentials present at the respective controlelectrodes 106 a, 106 b, 106 c. In embodiments, the potentials at thecontrol electrodes 106 a, 106 b, 106 c causes the generating of spacecharge regions in semiconductor regions below the respective controlelectrode. As will be described further below, the device 100 is capableto generate space charge regions of different extensions below therespective control electrodes 106 a, 106 b, 106 c based on therespective electric potential present at the control electrode. Below arespective control electrode, the extension of the space charge regionand therefore the electric potential is approximately constant while inthe region between two adjacent control electrodes with different spacecharge extensions electric drift fields are generated. As a result apotential distribution for photo-generated charge carriers is generatedin the semiconductor region near the substrate surface causing driftfields in a lateral direction depending on the electric potentialspresent at the control electrodes 106 a, 106 b, 106 c.

In one embodiment, the electric potential of at least one of the controlelectrodes may be mainly generated by a capacitive coupling to othercontrol electrodes. This has the advantage of reduced currentconsumption as the at least one control electrode is not actively drivenbut only by way of a capacitive divider. By supplying potentials to thecontrol electrodes surrounding the at least one control electrode, acharge redistribution at the control electrode 106 c is initiated whichcauses the potential of the at least one control electrode in operationto be between the currently present potentials of the adjacent controlelectrodes. With at least one of the actively driven control electrodesbeing driven with varying electric potential, continuous chargeredistribution is effected in the at least one control electrode.Distinguished from the other control electrodes which have theirpotentials supplied by fixed potential sources or time-varying potentialsources, the potential of the control electrode is driven by capacitivecoupling to the other control electrodes allowing to reduce the currentconsumption for driving the control electrodes.

FIG. 1B shows a diagram resulting from an example operation of thecontrol electrodes 106 a, 106 b and 106 c of FIG. 1A according to anembodiment. FIG. 1B shows as abscissa the electric potentialdistribution as negative electric potential caused by the controlelectrodes 106 a, 106 b, and 106 c in the semiconductor regions belowthe control gates. The negative electric potential corresponds to thepotential energy seen by photo-generated electrons (negative charges)which arc in the described embodiments the charge carriers to betransferred by the control electrodes 106 a, 106 b, 106 c.

As can be seen, the potential applied to the first control electrode 106a (indicated in FIG. 1B by “a”) varies such that a maximum of thepotential energy is obtained at time t=0 and a minimum is obtained attime t=T/2. The second control electrode 106 b (indicated in FIG. 1B by“b”) is kept constant. It can be seen at both times t=0 and t=T/2, thepotential distribution is a step-wise such that for the controlelectrode 106 b arranged between the control electrodes 106 a and 106 cthe potential of the control electrode 106 b is also between thepotential of the control electrodes 106 a, 106 c. The use of two controlelectrodes driven by time-varying signals while one control electrodesis maintained on a constant electric potential provides the requiredstep-wise potential distribution in a very power-efficient manner sinceno time-varying driving signal has to be applied to the controlelectrode 106 b.

It is to be noted that the number of steps in the potential distributiongenerated by the control electrode configuration can be increased byadding additional control electrodes. If the number of controlelectrodes is K, the number of steps in the potential distribution addsup to K+1.

In the operation described above, the generated charge carriers may beguided by the electric field generated by the control electrodes to readout nodes which are arranged lateral to the control electrode structure.In other words, the control electrode arrangement is capable to providea bidirectional transfer to each lateral side once the charge carriersreach the influence zone of the control electrodes. In opticaltime-of-flight sensors the controlling of the charge carriers is timecritical since the operation depends on the timely transportation of thecharge carriers to the laterally arranged read-out nodes.

In conventional systems, charge carriers generated inside thephoto-conversion region move only by diffusion from the origin of thecharge generation to the influence zone of the control electrodes 106 a,106 b, 106 c. Only at the influence zone of the control electrodes 106a, 106 b, 106 c the charge carriers are then subjected to an electricfield and thereby transferred laterally to the control electrodestructure based on the corresponding potential distribution applied tothe control electrodes 106 a, 106 b, 106 c. However, in time criticalapplications such as in a demodulation pixel for a continuous wave (cw)time-of-flight system, this may be a limiting factor since it might taketoo long for the charge carriers to move from inside thephoto-conversion region to the zone of influence by the controlelectrodes 106 a, 106 b, 106 c. Also, with diffusion as only mechanismfor vertical movement, a certain percentage of the charge carriers islost and does not reach the zone of influence and therefore is lostbefore reaching the read out nodes. This reduces the effectiveness ofthe system. Since many time-of flight systems use infrared light whichhas a higher penetration depth than visible light, the mean distancefrom the origin of charge generation to the control electrodes 106 a,106 b, 106 c is even increased.

Embodiments described herein provide for an improved and more efficientcontrolling of photo-generated charge carriers by generating an electricbuilt-in field for establishing a drift movement.

The electric built-in field may have in some embodiments substantially avertical field component resulting in a vertical field movement frominside the photo-conversion region towards the plane in which thecontrol electrodes 106 a, 106 b, 106 c are arranged as shown in FIG. 1A.As will be described later on, in some embodiments, the electricbuilt-in field establishes in some parts of the photo-conversion regionnot only a vertical movement but also a lateral movement. In otherwords, in some embodiments, the electric built-in field may have in atleast some regions of the photo-conversion region lateral fieldcomponents in addition to vertical field components. In someembodiments, the lateral movement effected by the built-in field effectsa concentration of the charge carriers in predefined sections.

In embodiments, the electrical built-in field is a static built-in fieldgenerated by providing a non-uniform net doping profile in thephoto-conversion region. FIG. 1A shows an exemplary doping profile 122where a region of specific net doping concentration is shown as onecontinuous line. The direction of acceleration experienced by thephoto-generated electrons in the resulting electric built-in field ofthe non-uniform doping concentration is shown in FIG. 1A as black bulkarrows. The direction of acceleration experienced by electrons in viewof the time-varying control signals applied to the control electrodes106 a, 106 b, 106 c is shown as grey bulk arrows in FIG. 1A.

It is further to be noted that the electric built-in field isestablished in the described embodiments by a non-uniform doping profileof only one type of doping (n-doping or p-doping). Thus thebuilt-in-field is different from a built-in field established in bipolarjunctions. In particular, it is to be noted that the strength of theelectric built-in field is determined by the gradient of the dopingconcentration. In other words, the more the doping concentration changesper unit length in a direction, the higher the component of the electricbuilt-in field is established in this direction. In some embodiments,the doping concentration in the photo-conversion region continuouslychanges in the vertical direction, such that an electric built-in fieldwith vertical vector components is established in the photo-conversionregion. While the described embodiments use built-in fields establishedby doping of only one carrier type, it is to be noted that otherembodiments may use instead of or in addition thereto electric built-infields established by bipolar doping profiles.

In some embodiments, the vertical component of the electric built-infield may be constant. The electric built-in field can be calculatedaccording to E=kB*T/q0 d ln(Na)/dz, where kB is the Boltzmann constant,T is the absolute temperature, q0 is the charge of the charge carrierand d ln(Na)/dz is the change of the natural logarithm of the dopingconcentration with increasing distance in vertical direction. Thus, alinear built-in field can be achieved by providing a doping profile inwhich the logarithm of the doping concentration changes linearly in thevertical direction. In other embodiments, the doping profile may beprovided in which the logarithm of the doping concentration is changingsuper-linearly in vertical direction. Then, a resulting built-in fieldwith a vertical field component which increases in the verticaldirection may be obtained. Such embodiments may compensate for thereduced carrier mobility due to the higher doping concentration withincreasing depth for example to obtain a constant drift velocity of thecharge carriers. The above embodiments may allow a more effectivetransport of the charge carriers in the vertical direction since chargecarriers which are generated farther away from the control electrodes106 a, 106 b, 106 c are subjected to a stronger acceleration force bythe built-in field as compared to charge carriers generated nearer tothe control electrodes 106 a, 106 b, 106 c.

In some embodiments, the non-uniform doping profile may extend in thevertical direction from the control electrodes to at least between 3 μmto 50 μm, where each value in this range and each sub-range of thisrange forms a specific embodiment.

The non-uniform doping profile may in some embodiments be generated byproviding a doped layer comprising dopants in a semiconductor layer withan afterward migration of at least a portion of the dopants of the dopedlayer to at least a region above the doped layer. FIG. 6 shows anexample manufacturing flow process 600. At 602, a doped layer isprovided wherein at 604 a part of the dopants of the doped layer aremigrated afterwards to provide the non-uniform doping profile. Themigration step may in some embodiments include a heat treatment. In someembodiments, the doped layer may have a width (full width at halfmaximum in vertical direction) between 0.1 and 5 μm before the migrationstep with each value in between and each sub-range forming a specificembodiment. In some embodiments, an activation step may be applied tothe doped layer before the migration step. The activation step mayinclude a drive-in anneal to minimize defects. In some embodiments, thenon-uniform doping profile may extend in the vertical direction from thecontrol electrodes to at least between 30% and 300% of the width(lateral extension) of the lateral extension of the control electrodesassociated with one region to accumulation, where each value in thisrange and each sub-range of this range forms a specific embodiment.

The portion of the dopants of the doped layer which migrates to theregion above the doped layer may in some embodiments be in the rangebetween 1% and 30% of the doping concentration of the doped layer.Finally, at 606 the control electrode structure is generated above thenon-uniform doping profile.

The doping profile may be generated in some embodiments by a graded-epiprocess wherein the doping profile varies gradually during the epitaxialgrowth of the material forming the photo-conversion region. In someembodiments, a step-wise doping profile may be generated in to providethe build-in field. In some embodiments, a step-wise doping profile maybe generated followed by a migration step in which the dopants of thestep-wise doping profile are migrate to smooth out the doping steps.Such a migration step may be provided by applying heat. Before themigration step, an activation step may be provided to activate thedopants. The activation step may include for example the application ofheat. The step-wise doping profile may include any number of steps suchas two steps, three steps etc. The step wise doping profile may includefor each step in net doping concentration at least one flat region wherethe doping profile doesn't change or changes slowly in verticaldirection and one steep regionwhere the doping profile change invertical direction is much higher than in the flat region. FIG. 9 showsan example of a step-wise doping profile 910 before the migration step.In FIG. 9, the ordinate corresponds to the the net doping concentrationat a logarithmic scale in arbitrary units and the abscissa correspondsto the vertical axis (z-axis). In the doping profile 910 of FIG. 9, afirst flat region 901 at high net doping concentration is followed by afirst step region 902 which is followed by a second flat region 903 at adoping concentration lower than the first flat region. At the other end,the second flat region 903 is followed by a second steep region 904which is followed by a third flat region 905 at a net dopingconcentration lower than the second flat region 903. It is to beunderstood that FIG. 9 shows only one of many examples for realizing astep-wise doping profile. The flat regions of the step-wise dopingprofile have a greater extension in vertical direction than the steepregions. In some embodiments, the ratio of the extension in verticaldirection of the flat region and steep region is between 3:1 and 10:1.In some embodiments, each of the flat regions may have an extension inthe vertical direction between 3 and 8 μm, wherein each value and eachsubrange forms an embodiment. In some embodiments, each of the steepregions may have an extension in the vertical direction between 0.3 and1.5 μm wherein each value and each subrange forms an embodiment. Afterapplying the migration step by heating, the step-wise doping profile 910is transformed into a doping profile 912. The net doping concentrationof the doping profile 912 may change in the vertical direction from afirst doping concentration which is in the range between 10¹⁹ and 10¹⁷cm⁻³. to a second net doping concentration which is in the range between10¹³ to 10¹⁵ cm⁻³. The average slope of the doping profile 912 describedby the logarithm of the net doping concentration change in cm⁻³ per 1 μmmay be in the range between 0.6 and 0.3, wherein each value and eachsubrange forms an embodiment. It is to be noted that such average slopesmay also be achieved by other manufacturing and doping methods. In someembodiments, a step-wise epi-process may be applied in which a first epilayer with a first doping concentration and a second epi layer with asecond doping concentration is grown. In some embodiments, thegraded-epi process or the step-wise epi process may be combined with amigration step of the dopants allowing a efficient and improvedtailoring of the doping profile. In some embodiments, a doped layer maybe provided in combination with the graded-epi process or the step-wiseepi process to provide additional tailoring of the doping profile.

FIG. 2A shows a device 200 including a doping profile with a dopedlayer. While device 200 includes additional elements not shown in FIG.1A, it is to be noted that the doping profile explained later on may bealso applied to the device structure shown in FIG. 1A as well as toother element configurations and control electrode configurations. Insome embodiments, a region to accumulate the photo-generated chargecarriers laterally to the control electrodes is provided.

Distinguished from FIG. 1A, FIG. 2A shows diode structures 114functioning as read-out nodes lateral to both ends of the electrodestructure. The diode structures 114 function to accumulate chargecarriers and may be formed for example by a doped well within thesubstrate. The control electrode structure is arranged between bothdiode structures 114. The diode structures 114 are electricallyconnected by connecting structures 118 for providing output signals tofurther processing. In addition to the control electrodes 106 a, 106 band 106 c, additional separation electrodes 106 d and 106 e held at aconstant electric potential are provided between the diode structures114 and the control electrodes 106 a, 106 b, 106 c. The separationelectrodes 106 d and 106 e function to limit influences of the controlelectrodes 106 a, 106 b, 106 c such as a signal coupling to the diodestructures 114. Furthermore, a buried channel 206 is provided to enhancethe lateral transport of the charge carrier under the influence of thecontrol electrodes 106 a, 106 b, 106 c. Similar to FIG. 1B, FIG. 2Bshows for an example operation the corresponding potential distributionsgenerated by the control electrodes 106 a, 106 b, 106 c and theseparation electrodes 106 d and 106 e.

Distinguished from FIG. 1A, the electric built-in field established bythe doping profile according to FIG. 2A has in some regions of thephoto-conversion region not only a vertical field component but also alateral field component. The doping profile has a lateral variation ofthe net doping concentration substantially symmetric with respect to aplane through the centre of the control electrode structure as shown inFIG. 2A. The mirror symmetry establishes in addition to the verticalmovement also a lateral movement to concentrate the charge carriers in apredefined section of the pixel which may for example be the section ofhighest transfer efficiency of the control electrodes 106 a, 106 b, 106c.

To achieve the lateral field components, the photo-conversion regioncomprises in the embodiment of FIG. 2A a doped layer 202 having alateral variation of the net doping concentration. In the embodiment ofFIG. 2A, the doped layer 202 is segmented in a first section 202 a, asecond section 202 b and a third section 202 c. The doped layer 202 mayfor example be a provided as a buried layer provided within amanufacturing process.

The first and third section 202 a, 202 c surrounding the second section202 b are doped to a higher net-doping concentration than the secondsection 202 b. In some embodiments, the first and third sections 202 a,202 c may have substantially the same net doping concentration. Thenon-uniform doping profile provided in the embodiment of FIG. 2A may begenerated by a migration of dopants of the doped layer 202 as explainedabove with respect to FIG. 6.

It can further be observed from FIG. 2A that a local maximum in thevertical direction of the net doping concentration is provided by thedoped layer 202 in the photo-conversion region. In other words, the netdoping concentration decreases when moving from the doped layer 202 inthe vertical direction towards the control electrodes 106 a, 106 b, 106c as well as when moving from the doped layer 202 in the verticaldirection away from the control electrodes 106 a, 106 b, 106 c. Thisresults in the vertical component being reversed above and below thedoped layer 202. With such a doping profile, a depth-selective transportof the photo-generated charge carriers can be provided. It allowsdiscarding photo-generated charge carriers generated deep in thesubstrate which would not be timely transported to the influence zone ofthe control electrodes 106 a, 106 b, 106 c by providing a transportwhere such photo-generated charge carriers are moved away from thecontrol electrodes 106 a, 106 b, 106 c. Thus, the contrast can befurther improved by providing such a depth selective transportmechanism.

Similar to FIG. 1A, the black bulk arrows in FIG. 2A show theacceleration vector field corresponding to the electric built-in field.It can be observed that the established built-in field provides theconcentration effect in view of the mirror symmetry as well as thedepth-selective effect causing photo-generated electrons which aregenerated below the doped layer 202 to be directed away from the controlelectrode structure.

It is to be realized that many variants of tailoring the electricbuilt-in field are possible. In some embodiments, the lateral variationof the net doping concentration in the doped layer includes at least avariation of at least 30% of the maximum net doping concentration of thedoped layer. While FIG. 2A shows a lateral variation of the dopingconcentration by providing three sections, it is to be understood thatother lateral variations can be implemented including a doped layer withmore than three sections of different doping concentrations or acontinuous variation of the doping concentration of the doped layer.

The non-uniform doping profile may have a net doping concentration whichincreases with increasing depth along a vertical direction from a firstnet doping concentration in the range between 10¹² cm⁻³ and 10¹⁵ cm⁻³ toa second net doping concentration in the range between 1.1×10¹⁵ cm⁻³ and10²⁰ cm⁻³, with every value in each range and every sub-range in eachrange forming an embodiment.

In some embodiments, the section of the doped layer 202 with the lowestnet doping concentration may be below a central section of the controlelectrode structure as shown in FIG. 2A. In some embodiments, thecentral section of the control electrode structure may be the in themiddle between the two lateral read-out nodes. This provides theconcentration effect at the central section of the control electrodestructure where modulation efficiency for the charge carriers ishighest. It is however to be noticed that many variations of thenon-uniform doping profile may be provided including non-symmetricaldoping-profiles.

In some embodiments, the doped layer 202 may have the lower dopedsection 202 b at substantially the same net doping concentration as thesubstrate 102 before the migration of dopants is effected as explainedwith respect to FIG. 6. FIG. 3 shows an embodiment of a device 300having a doping concentration as explained above. The structures of thedevice 300 basically correspond to the structures explained with respectto FIG. 2A. It can be observed from FIG. 3 that a part of the dopantsfrom the section 202 a and section 202 c have migrated to the centralsection 202 b to form the doping profile in the section 202 b as well asin other parts of the photo-conversion region.

In some embodiments, a further doped layer may be provided in thesubstrate at a depth (distance in z-direction from the surface at whichthe control gates are arranged) different than a depth of the otherdoped layer.

FIG. 4 shows an embodiment of a device 400 similar to FIG. 2A includinga further doped layer 204. The further doped layer 204 may extend inembodiments in a lateral direction at least beyond a predefined regionto which the photo-generated charge carriers are directed by the controlelectrodes 106 a, 106 b, and 106 c. In other words, in embodiments, thefurther doped layer may extend at least under and beyond the diodestructure 114 to which the photo-generated electrons are directed by thecontrol electrodes 106 a, 106 b, and 106 c. As can be seen in FIG. 4,the doped layer 204 provides in addition to an increased concentrationeffect also a shielding effect for the diode structure 114 such thatphoto-generated electrons are not allowed to directly move from insidethe photo-conversion to the diode structure 114 but only by theinfluence of the electric fields established by the control electrodes106 a, 106 b, 106 c.

In some embodiments, the doped layer 202 may be provided at or proximatethe backside of the substrate 102 as shown in FIG. 5. The doped layer202 provided at or proximate the backside may be provided with a lateralnet doping variation for example by having different sections withdifferent net doping concentrations as explained above. In someembodiments, the doped layer 202 may have no lateral doping variation,i.e. the net doping concentration may be constant through the dopedlayer 202. It is to be noted that the embodiment of FIG. 5 allows havinga backside illumination instead of a front side. In other words, thelight may penetrate from the backside of the substrate 102 into thephoto-conversion region. A thinning process may be used in embodimentsin order to provide the substrate with a thickness in a range between 20μm and 100 μm, where each value of the range and each sub-range forms aspecific embodiment.

Applications of the devices explained above may include photon-mixingapplications in order to provide demodulation in time-of-flight systemswhere the control electrode structure is configured to receive anelectric signal which is linked in a time relationship (e.g. phasedelay) to the modulation signal.

FIG. 8 shows an embodiment of a device 800 where light generated by alight source 802 is continuously amplitude modulated based on amodulation signal 804 generated by a signal source 806. The modulationsignal may include a sine waveform but other signal waveforms such asrectangular or triangular waveforms may be used as well. The modulatedlight signal is provided to determine the distance to an object 808. Themodulated light reflected by the object 808 is directed to an imagerdevice 810 which includes pixels as shown for example in the embodimentsdescribed with respect to FIGS. 1A, 2A, 3, 4 and 5. In the imager device810, a signal 804A which corresponds to the modulation signal 804 phaseshifted by a predetermined phase, e.g. 0°, 90°, 180° and 270°, isprovided to the control electrodes for mixing and demodulation of thereflected light within each pixel. Certain time intervals are assignedfor each of the predetermined phases. After integrating the signals inthe respective time intervals for each phase 0°, 90°, 180° and 270°,output signals J0, I1, I2 ,I3 are obtained corresponding to each phase.From the output signals J0, I1, I2, I3, the phase informationcorresponding to the time to travel can be computed as is known to aperson skilled in the art. It is to be noted that the structure of FIG.2A having two read-out nodes at both sides allows to simultaneouslyobtain the phases I0 and I2 and the phases i1 and I3, respectively.

In a further processing of the output signals, information correspondingto the distance of the object 808 is provided to a user. In theembodiment shown in FIG. 8, the signal 804A is provided in timeintervals phase shifted with respect to the modulation signal 804. It isto be understood that only the relative phase shift of the modulationsignal and the demodulation signal is required. Therefore, in otherembodiments a system with interchanged signals 804 and 804A may beprovided in which the modulation signal 804 for the light modulation isphase shifted in different time intervals with respect to the signal804A which is provided with no phase change.

While the embodiment described includes 4-phase calculations, it is tobe noted that other calculations using 3 phase delays or 5 or more phasedelays may be utilized in other embodiments.

Referring now to FIG. 7, a flow diagram of an example light demodulationwhen using the device 800 will be described. In a first step 702, thelight source is modulated based on a periodic modulation signal togenerate a continuous wave light beam. At 704, the modulated light beamis provided to an object. At 706, the modulated light beam which isreflected from the object is provided to a photo-conversion regionhaving an electric built-in field caused by a non-uniform doping profileas explained above. At 708, a time varying potential distributions aregenerated by the control electrodes based on an application of signals.

It is to be noted that the application in a continous time-of-flightsystem is only of example character and many other application of theconcept described herein may be utilized for example in time-of-flightsystems based on light pulses etc.

In the above description, embodiments have been shown and describedherein enabling those skilled in the art in sufficient detail topractice the teachings disclosed herein. Other embodiments may beutilized and derived there from, such that structural and logicalsubstitutions and changes may be made without departing from the scopeof this disclosure.

This Detailed Description, therefore, is not to be taken in a limitingsense, and the scope of various embodiments is defined only by theappended claims, along with the full range of equivalents to which suchclaims are entitled.

Such embodiments of the inventive subject matter are described hereinwithout intending to voluntarily limit the scope of this application toany single embodiment or concept if more than one is in fact disclosed.Thus, although specific embodiments have been illustrated and describedherein, it should be appreciated that any arrangement calculated toachieve the same purpose may be substituted for the specific embodimentsshown. This disclosure is intended to cover any and all adaptations orvariations of various embodiments. Combinations of the aboveembodiments, and other embodiments not specifically described herein,will be apparent to those of skill in the art upon reviewing the abovedescription.

It is further to be noted that specific terms used in the descriptionand claims may be interpreted in a very broad sense. For example, theterms “circuit” or “circuitry” used herein are to be interpreted in asense not only including hardware but also software, firmware or anycombinations thereof. The term “data” may be interpreted to include anyform of representation such as an analog signal representation, adigital signal representation, a modulation onto carrier signals etc.The term “information” may in addition to any form of digitalinformation also include other forms of representing information. Theterm “entity” or “unit” may in embodiments include any device, apparatuscircuits, hardware, software, firmware, chips or other semiconductors aswell as logical units or physical implementations of protocol layersetc. Furthermore, it may be noticed that a device or apparatus mayinclude separate parts such as multiple chips, multiple logical unitsetc. Furthermore the terms “coupled” or “connected” may be interpretedin a broad sense not only covering direct but also indirect coupling.

It is further to be noted that embodiments described in combination withspecific entities may in addition to an implementation in these entityalso include one or more implementations in one or more sub-entities orsub-divisions of said described entity. For example, specificembodiments described herein to be implemented in a TOF imager devicemay be implemented in other imager devices or other devices with a needfor a fast and efficient collection of carriers in a predefined area.

The accompanying drawings that form a part hereof show by way ofillustration, and not of limitation, specific embodiments in which thesubject matter may be practiced.

In the foregoing Detailed Description, it can be seen that variousfeatures are grouped together in a single embodiment for the purpose ofstreamlining the disclosure. This method of disclosure is not to beinterpreted as reflecting an intention that the claimed embodimentsrequire more features than arc expressly recited in each claim. Rather,as the following claims reflect, inventive subject matter lies in lessthan all features of a single disclosed embodiment. Thus the followingclaims are hereby incorporated into the Detailed Description, where eachclaim may stand on its own as a separate embodiment. While each claimmay stand on its own as a separate embodiment, it is to be notedthat—although a dependent claim may refer in the claims to a specificcombination with one or more other claims—other embodiments may alsoinclude a combination of the dependent claim with the subject matter ofeach other dependent claim. Such combinations are proposed herein unlessit is stated that a specific combination is not intended. Furthermore,it is intended to include also features of a claim to any otherindependent claim even if this claim is not directly made dependent tothe independent claim.

It is further to be noted that methods disclosed in the specification orin the claims may be implemented by a device having means for performingeach of the respective steps of these methods.

Further, it is to be understood that the disclosure of multiple steps orfunctions disclosed in the specification or claims may not be construedas to be within the specific order. Therefore, the disclosure ofmultiple steps or functions will not limit these to a particular orderunless such steps or functions are not interchangeable for technicalreasons.

Furthermore, in some embodiments a single step may include or may bebroken into multiple sub steps. Such sub steps may be included and partof the disclosure of this single step unless explicitly excluded.

1-9. (canceled)
 10. A method of manufacturing a device, the methodcomprising: providing a non-uniform doping profile in a semiconductorlayer such that an electric field with vertical field vector componentsis generated in at least a part of a photo-conversion region, whereinthe non-uniform doping profile has a doping concentration at a dopedlayer arranged at a depth within the semiconductor layer, wherein a netdoping concentration of the non-uniform doping profile decreases fromthe depth in a vertical direction towards a control electrode structuresuch that photo-generated charge carriers are directed towards thecontrol electrode structure, wherein the net doping concentration of thenon-uniform doping profile decreases from the depth in the verticaldirection away from the control electrode structure such thatphoto-generated charge carriers are directed away from the controlelectrode structure; and generating the control electrode structureincluding a plurality of control electrodes above the non-uniform dopingprofile for directing photo-generated charge carriers.
 11. The methodaccording to claim 10, wherein generating the control electrodestructure comprises: generating the plurality of control electrodes forapplying a substantially step-wise electric potential distribution inthe photo-conversion region.
 12. The method according to claim 10,wherein providing the non-uniform doping profile comprises: providing,in the semiconductor layer, the doped layer, wherein the doped layercomprises dopants; and providing a migration of at least a portion ofthe dopants of the doped layer to a region above the doped layer. 13.The method according to claim 12, wherein providing the doped layerfurther comprises: generating the doped layer such that the doped layercomprises a lateral variation of the net doping concentration.
 14. Themethod according to claim 13, wherein the lateral variation of the netdoping concentration is substantially symmetric with respect to a centerof the control electrode structure.
 15. The method according to claim10, further comprising: providing at least a first section of the dopedlayer with substantially a first net doping concentration and a secondsection of the doped layer with substantially a second net dopingconcentration such that the second net doping concentration is lowerthan the first net doping concentration.
 16. The method according toclaim 15, further comprising: providing a third section of the dopedlayer with substantially the first net doping concentration; and whereinthe second section of the doped layer is between the first section andthe third section of the doped layer.
 17. The method according to claim16, wherein the second section is below a central section of the controlelectrode structure.
 18. The method according to claim 1, furthercomprising: providing at least one further doped layer at a depthdifferent than the depth of the doped layer.
 19. The method according toclaim 18, wherein the further doped layer extends in a lateral directionat least beyond a predefined region to which the photo-generated chargecarriers are directed.
 20. The method according to claim 15, wherein thesecond net doping concentration is substantially equal to a net dopingconcentration of the photo-conversion region.
 21. The method accordingto claim 10, wherein the net doping concentration of the non-uniformdoping profile increases with increasing depth along the verticaldirection from a first doping concentration in a range between 10¹² cm⁻³and 10¹⁵ cm⁻³ to a second doping concentration in the range between1.1×10¹⁵ cm⁻³ and 10²⁰ cm⁻³.
 22. The method according to claim 10,wherein the non-uniform doping profile is mirror-symmetric with respectto a predefined plane.
 23. The method according to claim 10, wherein thenon-uniform doping profile is provided such that the electric fieldcomprises vertical and lateral field vector components in at least apart of the photo-conversion region. 24-26. (canceled)
 27. A method ofmanufacturing a device, the method comprising: providing aphoto-conversion region to convert light into photo-generated chargecarriers, wherein the photo-conversion region has a doping concentrationthat varies in a vertical direction such that the photo-conversionregion has a non-uniform doping profile with a doping concentration at adoped layer arranged at a depth within the semiconductor substrate,wherein the doping concentration of the non-uniform doping profiledecreases from the depth in the vertical direction towards a controlelectrode structure such that photo-generated charge carriers aredirected towards the control electrode structure, and wherein the dopingconcentration of the non-uniform doping profile decreases from the depthin the vertical direction away from the control electrode structure suchthat photo-generated charge carriers are directed away from the controlelectrode structure; providing a first region to accumulatephoto-generated charge carriers; providing a second region to accumulatephoto-generated charge carriers; and generating the control electrodestructure that includes: a plurality of control electrodes to generate apotential distribution such that the photo-generated charge carriers areguided towards the first region to accumulate photo-generated chargecarriers or the second region to accumulate photo-generated chargecarriers, based on signals applied to the control electrode structure.28. The method of claim 27, wherein the doping concentration issubstantially symmetric with respect to a center of the controlelectrode structure such that a built-in electric field is substantiallymirrored with respect to a plane through a center of the controlelectrode structure.
 29. The method of claim 27, wherein the controlelectrode structure is arranged between the first region and the secondregion.
 30. The method of claim 27, wherein the non-uniform dopingprofile is a graded or a step-wise doping profile in a verticaldirection.
 31. The method of claim 27, wherein the doped layer extendsbeneath a portion of the control electrode structure that is less thanan entirety of the control electrode structure.
 32. A method ofmanufacturing a device, the method comprising: providing a substratewith a surface, the substrate comprising: a photo-conversion region toconvert incoming light into photo-generated charge carriers, wherein thephoto-conversion region has a doping concentration that varies in avertical direction such that the photo-conversion region has anon-uniform doping profile with a doping concentration at a doped layerarranged at a depth within the substrate, wherein the dopingconcentration of the non-uniform doping profile decreases from the depthin the vertical direction towards a control electrode structure suchthat photo-generated charge carriers are directed towards the controlelectrode structure, and wherein the doping concentration of thenon-uniform doping profile decreases from the depth in the verticaldirection away from the control electrode structure such thatphoto-generated charge carriers are directed away from the controlelectrode structure, and a first region to accumulate photo-generatedcharge carriers; and a second region to accumulate photo-generatedcharge carriers; and generating, at the surface of the substrate, thecontrol electrode structure to generate a potential distribution in thesubstrate such that the photo-generated charge carriers are guidedtowards the first region or the second region based on signals appliedto the control electrode structure.